Hirai Precision Industry Co., Ltd. Composite Processing Technology Introduction
Making possible what was impossible with etching processing! A processing technology with a wide range of applications.
Hirai Precision Industry Co., Ltd. offers adhesive processing and machining that can accommodate semiconductor package components as part of composite processing. Among these, machining is a processing technology capable of addressing areas that cannot be covered by etching processing. By introducing CO2 laser processing machines and wire electrical discharge machines, we have made it possible to cut and drill metals, plastics, ceramics, and other materials that are impossible to process with etching. Additionally, we can perform processing that combines etching with laser and wire electrical discharge, as well as reprocessing of ready-made products, providing a wide range of applications. [Features] ■ Processing that was impossible with etching is now possible ■ Wide range of applications *For more details, please refer to our catalog or feel free to contact us.
- Company:平井精密工業
- Price:Other